Panasonic Network Card 2SA1738 User Manual

This product complies with the RoHS Directive (EU 2002/95/EC).  
Transistors  
2SA1738  
Silicon PNP epitaxial planar type  
For high speed switching  
Unit: mm  
+0.10  
–0.05  
0.40  
+0.10  
–0.06  
0.16  
Features  
3
High speed switching (Pair with 2SC3757)  
Low collector-emitter saturation voltage VCE(sat)  
Mini type package, allowing downsizing of the equipment and au-  
tomatic insertion through the tape packing and the magazine  
packing.  
1
2
(0.95) (0.95)  
1.9 0.1  
+0.20  
2.90  
–0.05  
Absolute Maximum Ratings Ta = 25°C  
10˚  
Parameter  
Symbol  
VCBO  
VCEO  
VEBO  
IC  
Rating  
15  
Unit  
V
Collector-base voltage (Emitter open)  
Collector-emitter voltage (Base open)  
Emitter-base voltage (Collector open)  
Collector current  
1 : Base  
2 : Emitter  
3 : Collector  
15  
V
4  
V
EIAJ : SC-59  
50  
mA  
mA  
mW  
°C  
Mini3-G1 Package  
Peak collector current  
ICP  
100  
200  
Marking Symbol: AK  
Collector power dissipation  
Junction temperature  
PC  
Tj  
150  
Storage temperature  
Tstg  
55 to +150  
°C  
Electrical Characteristics Ta = 25°C 3°C  
Parameter  
Symbol  
ICBO  
Conditions  
Min  
Typ  
Max  
0.1  
0.1  
150  
Unit  
µA  
µA  
Collector-base cutoff current (Emitter open)  
Emitter-base cutoff current (Collector open)  
Forward current transfer ratio  
VCB = −8 V, IE = 0  
IEBO  
VEB = −3 V, IC = 0  
*
hFE1  
VCE = −1 V, IC = −10 mA  
VCE = −1 V, IC = −1 mA  
50  
30  
hFE2  
Collector-emitter saturation voltage  
Transition frequency  
VCE(sat) IC = −10 mA, IB = −1 mA  
0.1 0.2  
V
MHz  
pF  
fT  
VCB = −10 V, IE = 10 mA, f = 200 MHz 800  
1 500  
1
Collector output capacitance  
Cob  
VCB = 5 V, IE = 0, f = 1 MHz  
(Common base, input open circuited)  
Turn-on time  
Turn-off time  
Storage time  
ton  
toff  
tstg  
Refer to the switching time measurement circuit  
12  
20  
19  
ns  
ns  
ns  
Note) 1. Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7030 measuring methods for transistors.  
2. : Rank classification  
*
Rank  
Q
R
hFE1  
50 to 120  
90 to 150  
Publication date: November 2002  
SJC00026BED  
1
 
Request for your special attention and precautions in using the technical information and  
semiconductors described in this book  
(1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and  
regulations of the exporting country, especially, those with regard to security export control, must be observed.  
(2) The technical information described in this book is intended only to show the main characteristics and application circuit examples  
of the products, and no license is granted under any intellectual property right or other right owned by our company or any other  
company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any other  
company which may arise as a result of the use of technical information described in this book.  
(3) The products described in this book are intended to be used for standard applications or general electronic equipment (such as office  
equipment, communications equipment, measuring instruments and household appliances).  
Consult our sales staff in advance for information on the following applications:  
Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support  
systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the prod-  
ucts may directly jeopardize life or harm the human body.  
Any applications other than the standard applications intended.  
(4) The products and product specifications described in this book are subject to change without notice for modification and/or im-  
provement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product  
Standards in advance to make sure that the latest specifications satisfy your requirements.  
(5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions  
(operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute  
maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any  
defect which may arise later in your equipment.  
Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure  
mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire  
or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products.  
(6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS,  
thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which  
damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages.  
(7) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of Matsushita  
Electric Industrial Co., Ltd.  
 

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